Many Hicom and independent technical papers have been written on aspects of Hicom Grinding Technology.

Some examples are:

High-Intensity Size Reduction In The Hicom Mill Dr David I. Hoyer and Ralph Morgan

Hicom Attritioning To Remove Alumina-Silicate Coatings On Ilmenite Sand Grains Dr David I. Hoyer, B.M. Mulvihill& G.J.C. Young

The Discrete Element Method For Fine Grinding Scale-Up In Hicom Mills Dr David I. Hoyer

High-Intensity Autogenous Reduction Of Critical Size Material Dr David I. Hoyer

High-Intensity Autogenous Milling In The Hicom Mill – A Preliminary Simulation Model Dr David I. Hoyer

Industrial Application Of The Hicom Mill J.M. Boyes, D.I. Hoyer, G.J.C. Young

High-Intensity Autogenous Liberation Of Diamonds From Kimberlite In The Hicom Mill D. I. Hoyer & D. C. Lee

Power Consumption In Centrifugal And Nutating Mill Dr David I. Hoyer

High Intensity Fine And Ultrafine Grinding In The Hicom Mill David I Hoyer, John M Boyes

The High Intensity Nutating Mill – A Batch Ball Milling Simulator D I Hoyer & J M Boyes

Using The Discrete Element Method For Scale-Up Of Fine Grinding In Hicom Mills Dr David I. Hoyer

Centrifugal Mill Charge Motion And Power Draw Comparison Of DEM Predictions With Experiment Paul W Cleary, Dr David Hoyer